SOI MOSFET转移特性中的深度饱和现象研究
THE DEEP-SATURATION STUDY OF DRAIN CURRENT IN SOI MOSFET'S TRANSFER CHARACTERISTICS
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摘要: 研究了SIMOX SOI器件的电学特性.发现在众多的MOSFET中,输出特性曲线的低漏压端都出现了“鸟嘴”形畸变,表现在转移特性曲线上便是高栅压区域中漏电流的深度饱和.在经历沟道热载流子应力之后,这类器件的电学参数退化不同于一般器件的损伤特性.研究发现NMOSFET在应力之后其漏电流的深度饱和得到恢复;而对于PMOS,应力之后输出特性中的“鸟嘴”形畸变并没有消弱的迹象.这些性质对于SOI器件可靠性设计和可靠性加固均是重要的.Abstract: In this work, the electric characteristics of SOI MOSFET are investigated. The deep-saturation of drain current in transfer character is found in many transistors. After applying the channel hot-carriers stress, the electric parameters degradation is very different from that of the normal transistors. It has been shown that the deep-saturation effect in NMOSFET disappears after stress, but in PMOS, this effect is not weakened by hot-carriers injection. The results are of importance for reliability designing and reliability strengthening of SOI devices.
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