摘要:
本文研究了直拉单晶硅中形成洁净区后过渡族金属杂质铜的沉淀行为.样品经过高低高三步常规热处理形成洁净区后,在不同温度下引入杂质铜,然后对样品分别进行普通热处理和快速热处理,通过腐蚀和光学显微镜研究发现,在700?C引入铜杂质后经过普通热处理和快速热处理都不会破坏洁净区,在900?C和1100?C引入铜杂质后经过普通热处理不会破坏洁净区,而经过快速热处理会破坏洁净区.研究表明,快速热处理可以使硅片体内产生大量的空位,空位的外扩散是破坏洁净区的主要原因.
Abstract:
The precipitation behavior of copper in denuded zone (DZ) of Czochralski silicon has been systematically investigated by means of etching and optical microscopy (OM). Firstly, the samples were treated in a conventional furnace by high-low-high annealing for the formation of denuded zone. Subsequently, copper contamination was introduced at different temperatures. Finally, samples were treated with rapid thermal annealing (RTA) and conventional furnace annealing separately. It was found that, copper precipitates could be observed in DZ through OM only in the samples which experienced RTA followed by contamination in 900 ?C and 1100 ?C. This indicates that the out-diffusion of vacancy which is produced in the process of RTA is the main cause for the copper precipitation in DZ.
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