温度对金刚石涂层膜基界面力学性能的影响?

简小刚; 张允华

doi:10.7498/aps.64.046701

物理学报

温度对金刚石涂层膜基界面力学性能的影响?

简小刚, 张允华. 2015: 温度对金刚石涂层膜基界面力学性能的影响?, 物理学报, null(4): 046701. doi: 10.7498/aps.64.046701

引用本文:

简小刚, 张允华. 2015: 温度对金刚石涂层膜基界面力学性能的影响?, 物理学报, null(4): 046701. doi: 10.7498/aps.64.046701

Jian Xiao-Gang, Zhang Yun-Hua. 2015: The effect of temp erature on the mechanical prop erties of the diamond coating at the film-substrate interface, Acta Physica Sinica, null(4): 046701. doi: 10.7498/aps.64.046701

Citation:

Jian Xiao-Gang, Zhang Yun-Hua. 2015: The effect of temp erature on the mechanical prop erties of the diamond coating at the film-substrate interface, Acta Physica Sinica, null(4): 046701. doi: 10.7498/aps.64.046701

温度对金刚石涂层膜基界面力学性能的影响?

同济大学机械与能源工程学院,上海,201804

The effect of temp erature on the mechanical prop erties of the diamond coating at the film-substrate interface

摘要: 利用分子动力学方法建立了硬质合金基底金刚石涂层膜基界面模型，并采用Morse势函数和Tersoff势函数相互耦合的方法来表征模型内原子间的相互作用关系，在此基础上对不同温度(0—800 K)条件下硬质合金基底金刚石涂层膜基界面的力学性能进行了分子动力学仿真计算。结果表明：当温度由0 K上升到800 K的过程中，金刚石涂层膜基界面拉伸强度呈下降趋势，并且在0—300 K范围内下降趋势明显，在300—800 K范围内下降趋势缓和；体系能量随温度的变化具有相同的下降趋势。
- 金刚石涂层 /
- 膜基界面 /
- 分子动力学 /
- 膜基结合强度
Abstract: The model of the diamond coating at the film-substrate interface is established by using the molecular dynamic method. The interaction between the atoms in this model is described by the Morse potential function and Tersoff potential function. Based on the above, we carry out the molecular dynamic simulation of the mechanical properties of the model in a temperature range from 0 to 800 K. The simulation results show that the tensile strength of diamond coating at the film-substrate interface presents a downward trend as the temperature rises from 0 to 800 K:the downward trend is evident when the temperature is in a range of 0–300 K, and the downward trend is smooth when the temperature is in a range of 300–800 K. Meanwhile, the variation of system energy with temperature presents a downward trend similar to the variation trend of the tensile strength.

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温度对金刚石涂层膜基界面力学性能的影响?

同济大学机械与能源工程学院,上海,201804

关键词:

摘要: 利用分子动力学方法建立了硬质合金基底金刚石涂层膜基界面模型，并采用Morse势函数和Tersoff势函数相互耦合的方法来表征模型内原子间的相互作用关系，在此基础上对不同温度(0—800 K)条件下硬质合金基底金刚石涂层膜基界面的力学性能进行了分子动力学仿真计算。结果表明：当温度由0 K上升到800 K的过程中，金刚石涂层膜基界面拉伸强度呈下降趋势，并且在0—300 K范围内下降趋势明显，在300—800 K范围内下降趋势缓和；体系能量随温度的变化具有相同的下降趋势。

English Abstract

The effect of temp erature on the mechanical prop erties of the diamond coating at the film-substrate interface

同济大学机械与能源工程学院,上海,201804

Keywords:

Abstract: The model of the diamond coating at the film-substrate interface is established by using the molecular dynamic method. The interaction between the atoms in this model is described by the Morse potential function and Tersoff potential function. Based on the above, we carry out the molecular dynamic simulation of the mechanical properties of the model in a temperature range from 0 to 800 K. The simulation results show that the tensile strength of diamond coating at the film-substrate interface presents a downward trend as the temperature rises from 0 to 800 K:the downward trend is evident when the temperature is in a range of 0–300 K, and the downward trend is smooth when the temperature is in a range of 300–800 K. Meanwhile, the variation of system energy with temperature presents a downward trend similar to the variation trend of the tensile strength.

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温度对金刚石涂层膜基界面力学性能的影响?

The effect of temp erature on the mechanical prop erties of the diamond coating at the film-substrate interface

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温度对金刚石涂层膜基界面力学性能的影响?

English Abstract

The effect of temp erature on the mechanical prop erties of the diamond coating at the film-substrate interface

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