摘要:
半导体科学技术的出现和发展为人类社会的生产和生活带来前所未有的变革。半导体科学技术是信息产业的核心和基础,是推动传统工业转型升级的物质支撑,是支撑经济社会发展和保障国家安全的战略性、基础性和先导性基石。特别是作为半导体技术之一的微电子技术,不但自身是一个庞大的产业,它还作为核心部件在不断推动其他科技应用的迅速发展,从国防科技、现代工业到日常生活,各个领域无不渗透着半导体微电子技术。半导体科学技术已经成为一种既代表国家现代化工业水平又与人民生活息息相关的基础性高新技术,我们无法想象如果它在将来停止继续往前发展了会怎么样?随着晶体管的不断缩小,芯片集成度的不断提高,晶体管间的电互连面临包括散热、串扰、延迟在内的一系列问题,成为限制集成电路进一步发展的主要阻力。最新的14 nm 工艺,金属导线的最小间距只有52 nm,线宽只有几个纳米,已经非常接近物理极限。在同一芯片上集成光子学器件和电子学器件用光互连代替电互连的光电集成技术有望解决这一难题,硅基光互连具有高速度、高带宽、低功耗、可集成等特点。光互连的实现还将为进一步集成量子器件提供必要条件。目前硅基光电探测器、电光调制器、波分复用器、光波导等都已成功实现,但由于硅的间接带隙特点导致真正能够实用的硅基光源仍悬而未决。实现硅基发光器件成为实现硅基光电集成技术最具挑战和最重要的目标。本刊组织的“硅基光电子物理和器件”专题从理论设计高效发光硅锗超晶格,包括量子效应低维硅,硅基稀土掺杂,硅中缺陷发光和硅基锗材料在内的各种硅基发光材料制备、高迁移率锗沟道器件、硅基IV族异质结构发光器件和硅基III-V族量子点激光器等几个方面对各种硅基光源目前面临的问题和未来的发展方向进行系统的介绍和总结,推动国内硅基发光器件的研究进展,以期在国际上首先实现可实用的硅基发光器件。
Abstract:
To meet the requirements for high speed, low cost, and more information capacity, silicon photonics has been boom-ing in recent years. Silicon photonics covers a very wide field. For the silicon photonics, researchers have successfully achieved silicon-based optical waveguides, switches, modulators, and detectors. But the problem of silicon based light source has not been really resolved, which has become a primary bottleneck for further developing the silicon photonics. The momentum of a phonon is required to allow an electron to transit from the minimum of the conduction band to the maximum of the valence band in Si because of the indirect bandgap. This two-particle process with a low probability makes it di?cult to achieve high-e?ciency silicon-based light source by itself. However, much effort has been made to characterize and understand the light-emission phenomena of silicon-based devices. Also, more attempts were made to enhance the emission e?ciency of silicon. Practical silicon lasers are very important for silicon photonics and have been a long goal for semiconductor scientists. A number of important break-throughs in the past decade have focused on silicon as a photonic platform thanks to the efforts of scientists. In this review, we introduce the recent progress of silicon-based luminescence materials, silicon light emitting diodes and silicon lasers. In the first part of this paper, common types of silicon-based light emitting materials, including porous silicon, silicon nanocrystals, rare earth-doped silicon, silicon defect emission, germanium on silicon and semiconducting silicides are comprehensively reviewed. Among them, the quantum effects and surface effects of low-dimensional silicon can greatly enhance the light emission e?ciency. The erbium atoms in silicon-based rare earth materials can produce the light emission at communication wavelength band independently of the host. The transition from the lowest excited state to the 4f ground state yields light at 1.54 μm. Moreover the emission energy is independent of the temperature due to the inner atomic transition. Group IV materials grown on silicon such as Ge and GeSn alloy can change from indirect bandgap into direct bandgap by introducing mechanically strain and modifying the component. Strong enhancement of photoluminescence and net gain emerging from the direct transition are very significant for fabricating the devices. In the second part, different light emitting diodes (LEDs) fabricated with above luminescent materials are intro-duced. The Si PN diodes were once popular at the earlier research stage. One approach was to modify the effective surface on high-purity single crystal silicon and the other idea was to use optically active defects in silicon. Ten years later, silicon LEDs in which the dressed-photon-phonons assisted method is used, made the Si PN diode rejuvenated. LEDs fabricated on nano-structured Si and silicon-based film were limited in the optoelectronic integration since the luminescence wavelength is not corresponding to the low-loss communication region. Although erbium-doped and Er silicate LEDs emit suitable light, their high turn-on voltage and low luminescence e?ciency block the practical applica-tion. The researches of Ge-on-Si LED mainly focus on modifying the band structure by introducing strain and n-doping.In the third part, firstly we summarize the basic rules of the silicon laser. Then, we review the most recent progress in the field. Nanometer Si with periodic array can only behave unambiguous laser action using optical pumping and at very low temperature. Low threshold silicon Raman lasers with racetrack ring resonator cavities can only stop on paper also due to the di?culty in electrical pumping. The Ge-on-Si lasers operating at room temperature by optical and electrical pumping were accomplished in the past 5 years. The GeSn laser that is CMOS-compatible also came into being this year. Although so far, lasing has been implemented only by using pulsed optical pumping and stopped working at 90 K, this first demonstration of lasing in a direct-gap group IV alloy grown on standard silicon substrates is potentially an important step on the way to a platform of fully integrated silicon-based photonics. Hybrid III-V-on-Si lasers are considered as one of the most practical means due to the excellent photoelectric properties and mature preparation technology. Finally, current problems and future development direction in the silicon light source are also presented briefly.