Figure 8 ,Table 1
    • Figure Fig. 1.  (Color online) (a) The process of planar structure photodiode fabrication through diffusion and the final device structure. (b) SEM diagram of the fabricated devices.

    • Figure Fig. 2.  (Color online) (a) SIMS test results. (b) The relationship between diffusion depth and diffusion temperature.

    • Figure Fig. 3.  (Color online) (a) The cross-section TEM image and (b) mapping energy spectrum of fabricated planar PN junction detector.

    • Figure Fig. 4.  (Color online) Simulation result of band structure based on SIMS data with a diffusion temperature of (a) 450 °C and (b) 550 °C.

    • Figure Fig. 5.  (Color online) The relationship between dark current density and bias at different temperatures for devices with diffusion temperatures of 450 and 550 °C.

    • Figure Fig. 6.  (Color online) The dark current mechanism of samples diffused at 450 and 550 °C.

    • Figure Fig. 7.  Performance curve and wavelength of the photodiode with a diffusion temperature of (a) 550 °C and (b) 450 °C.

    • Figure Fig. 8.  Infrared radiation imaging of (a) electric soldering iron and (b) lighter flame.